THERMAL SHRINKAGE, PARTIAL MELTING AND RECRYSTALLIZATION OF FIBROUS COPOLYMERS
نویسندگان
چکیده
منابع مشابه
Simulation of Dynamic Recrystallization in Solder Interconnections during Thermal Cycling
Solder alloys are widely used bonding materials in electronics industry. The reliability con‐ cerns for solder interconnections, which provide both mechanical and electronic connec‐ tions, are rising with the increasing use of highly integrated components in portable electronic products [1-6]. As shown in Fig. 1, a typical ball grid array (BGA) component board usually consists of a silicone die...
متن کاملLinkages in thermal copolymers of lysine.
The thermal copolymerization of lysine with other alpha-amino acids has been studied further. The identity of the second amino acid influences various properties of the polymer obtained, including the proportion of alpha and epsilon linkages of lysine. A review of linkages in proteinoids indicated alpha and beta linkages for aspartic acid, alpha and gamma linkages for glutamic acid, alpha and e...
متن کاملThermal Field-Flow Fractionation of Acrylic Copolymers
A new thermal field-flow fractionation (ThFFF) method has been developed for the separation and analysis of polyacrylates and acrylic-styrene copolymers. This important class of polymers is commonly used as pressure sensitive adhesives, in coatings and paintings, and as the basis for polyelectrolyte materials. The structure and chemical composition of these polymers play a vital role in the end...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Sen'i Gakkaishi
سال: 1973
ISSN: 0037-9875,1884-2259
DOI: 10.2115/fiber.29.6_t234